Koresha Ingano Zinyuranye Zashyizwe hamwe na Silica Wafers

Ibisobanuro bigufi:

Ibikoresho: silika ikoreshwa
Isuku ryinshi: SiO2> 99,99%
Ubuso Burangiza: Kuruhande Kabiri
Ubwiza bw'ubuso: 60/40
Imiterere: Uruziga
Ubushobozi bwo gutanga: 150000 Igice / Ibice buri kwezi

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Ibicuruzwa birambuye

Ibicuruzwa

Koresha Ingano Zinyuranye Zashyizwe hamwe na Silica Wafers

Ibisobanuro bya Quartz Wafers

Oya.	Izina	Ingano	Igice
1	OD Diameter	150±0.2	mm
2	Umubyimba	1.0±0.1	mm
3	OF	47.5±2.5	mm
4	Kuringaniza	Icyiciro cyiza	60/40
5	Kubeshya	<25	μm
6	BOW	<25	μm
7	TTV	<10	μm
8	OH	200-500	ppm
9	Impande (A)	0.5±0.1mm
	Chamfer (C)	0.3±0.1mm
	Imiterere (A&C)	Rrms <0.03μm
	Inguni	45° ±5°

Igishushanyo cya Ff ya Quartz Wafers

Ibyiza Byiza bya Quartz Ikirahure

Porogaramu ya Silica Wafers

Ubusanzwe UV, CTE nkeya, optoelectronic, ubushyuhe bwo hejuru, amashusho yubushyuhe, gupima hamwe na tekinoroji ya sensor, astronomique, microlithography, MEMS, Excimer na Nd: Porogaramu ya YAG laser, kandi aho hakenewe urwego rwo hejuru rwahujwe na silika wafer.

Kuyobora Igihe

Kubice byimigabane, twohereza hanze mugihe cyicyumweru.Kubice byabigenewe, nyamuneka twandikire kubindi bisobanuro.Niba ukeneye byihutirwa, tuzategura mubyambere.